Profile: Plansee Thermal Management Solutions manufactures controlled expansion high thermal conductivity metal matrix composites for the microelectronics industry, wireless communication, internet infrastructure military, aerospace and industrial applications. Our product includes flip chip lids for ceramic packages, multi layer co-fired ceramic packages, high speed digital packages, fiber optic packages, microwave carriers and accelerometers. Our material includes copper tungsten, copper molybdenum and copper-molyCopper-copper laminate. Our capabilities include thermals management materials manufacture, ceramic manufacture, plating, brazing, prototyping and design. We are accredited with ISO 9001 standards.