Solderability test employs moisture and temperature stress during accelerated aging. Loss of solderability occurs due to chemical reactions between the lead coating and the atmosphere during storage, which reduces the force of attraction between the solder and the leads. The only way to determine the solderability of a component lead is to expose it to molten solder. Solderability testing involves observing the extent of solder coverage on a lead after dipping it in solder.

Soldering Iron Analyzer has a portable unit with long battery life. It checks either temperature stability or absolute temperature. It uses contact pyrometer for monitoring stability. Low-level voltage is measurable from working area of tip to ground. It is developed for testing soldering irons for compliance with the DOD-STD-2000 and the new MIL-STD-2000 specifications. It is a portable unit capable of testing tip temperature, tip to ground resistance and tip to ground noise.