Profile: Addison Engineering, Inc. specializes in semiconductor processing equipment, materials and services. Our products include silicon wafers, silicon wafer processing, silicon wafer operations management, ceramic packages and related semiconductor materials. We provide silicon wafers in diameters of 2 & 3 inches, 100mm, 125mm, 150mm, 200mm, and 300mm. It includes extra thin wafers, silicon rings, quartz (fused silica), pyrex (borosilicate) and soda lime. Our ceramic packages include side braze, pin grid array, leadless/leaded chip carriers, flatpacks, headers, cerdip and cerpac.
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|•||Electronics Components||•||Semiconductor Materials||•||Semiconductor Process Equipment|