Profile: HillTron Corporation offers both lead-free & leaded soldering options on PCB assembly, flex circuit assembly, rigid flex assembly, and wafer substrate assembly. Alloy used for lead-free solder is tin-silver-copper (Sn95/Ag3.5/Cu0.7) with a melting range of 217-220 deg C. We assemble or re-work BGA, Micro-BGA, CSP, QFN, SON, and similar packages. We have re-worked BGAs with 1400 pins & heat sinks on it.
8 Products/Services (Click for related suppliers)
|•||BGA Rework||•||Consignment PCB Assembly||•||Flexible Circuit Assemblies|
|•||Lead-Free Soldering||•||Partial Turnkey PCB Assembly||•||Prototype PCB Assembly|
|•||Rework PCB Assembly||•||Turnkey PCB Assembly|