Profile: HyTek Europe company is a provider of dicing blades. We are involved with diamond grinding wheel applications in the microelectronics industry. We mainly manufacture and supply ultra thin resin bonded diamond & cbn dicing blades. We produce a wide range of super abrasive dicing blades which are used to cut very hard and brittle materials. The self-sharpening nature of resin bonds ensures that fresh abrasive grains are continually replenished to give quality cutting action. We cover applications and materials like ferrite, rare earth magnets, silicon carbide, silicon nitride, tool steels, ceramic packages, fiber optics, tungsten carbide, glass fiber circuit boards and aluminium titanium carbide.
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|•||Abrasive Cut-Off Wheels||•||Abrasive Wheels||•||Dicing Blades|